INFINEON - BACK IN THE SADDLE AGAIN: Shortly after disposing one of Rambus' infringement suits, Infineon now finds itself (along with Micron) defending a patent infringement suit brought by Tessera Technologies Inc., who is charging that the companies infringed upon Tessera's IP for packages used to house memory and other semiconductor devices.

The suit, filed in the U.S. District Court for the Eastern District of Texas, revolves around packages used for dynamic random access memory (DRAM) devices, confirmed Doug Norby, senior vice president and chief financial officer for Tessera.

Tessera settled a patent suit last November with Samsung Electronics Co. Ltd. of Korea involving multi-chip packages. Tessera ended up licensing its packaging IP to major semiconductor suppliers.

In the past, Tessera has also tangled with Texas Instruments Inc. and Sharp Electronics Corp. of Japan in packaging IP disputes.